Display apparatus

ABSTRACT

A display apparatus includes a substrate; a plurality of display units on the substrate, each including a thin film transistor including at least one inorganic layer, a passivation layer on the thin film transistor, and a display device electrically connected to the thin film transistor; and a plurality of encapsulation layers respectively encapsulating the plurality of display units. The substrate includes a plurality of islands spaced apart, a plurality of connection units connecting the plurality of islands, and a plurality of through holes penetrating through the substrate between the plurality of connection units. The plurality of display units are on the plurality of islands, respectively. The at least one inorganic layer and the passivation layer extend on the plurality of connection units. The passivation layer includes a trench exposing the at least one inorganic layer. The encapsulation layer contacts the at least one inorganic layer exposed via the trench.

CROSS-REFERENCE TO RELATED PATENT APPLICATION(S)

This application is a continuation of U.S. patent application Ser. No.17/572,922, filed Jan. 11, 2022, which is a continuation of U.S. patentapplication Ser. No. 16/916,003, now U.S. Pat. No. 11,222,943, filedJun. 29, 2020, which is a continuation of U.S. patent application Ser.No. 16/734,932 filed Jan. 6, 2020, now U.S. Pat. No. 10,700,158, whichis a continuation of U.S. patent application Ser. No. 16/181,283 filedNov. 5, 2018, now U.S. Pat. No. 10,529,794, which is a continuationapplication of U.S. patent application Ser. No. 15/430,095 filed on Feb.10, 2017, now U.S. Pat. No. 10,121,844, which claims priority to and thebenefit of Korean Patent Application No. 10-2016-0033989, filed on Mar.22, 2016, in the Korean Intellectual Property Office, the disclosures ofwhich are incorporated herein in their entirety by reference.

BACKGROUND 1. Field

The present disclosure relates to a display apparatus.

2. Description of the Related Art

As the display technology develops rapidly, various flat panel displayapparatuses having excellent characteristics such as a slim profile, alight weight, and low power consumption have been introduced. With therecent development in display technology, flexible display apparatuseshave been researched and developed, and stretchable display apparatusesthat are capable of being changed to various shapes are being activelyresearched and developed.

Meanwhile, a display apparatus having a slim profile and flexiblecharacteristics may include a thin film encapsulation layer to blockinfiltration of moisture, oxygen, etc. from outside. A conventional thinfilm encapsulation layer has a configuration in which inorganic layersand organic layers are alternately stacked. However, since the thin filmencapsulation layer is integrally formed with a display apparatus, thethin film encapsulation layer may degrade the flexibility of the displayapparatus, and the thin film encapsulation layer may be damaged when theshape of the display apparatus is changed.

SUMMARY

One or more embodiments of the present disclosure provide a displayapparatus.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

According to one or more embodiments, a display apparatus includes asubstrate; a plurality of display units disposed on the substrate, eachincluding a thin film transistor including at least one inorganic layer,a passivation layer disposed on the thin film transistor, and a displaydevice electrically connected to the thin film transistor; and aplurality of encapsulation layers respectively encapsulating theplurality of display units, wherein the substrate includes a pluralityof islands spaced apart from one another, a plurality of connectionunits that are connecting the plurality of islands to one another, and aplurality of through holes penetrating through the substrate between theplurality of connection units, the plurality of display units aredisposed on the plurality of islands, respectively, the at least oneinorganic layer and the passivation layer extend on the plurality ofconnection units, the passivation layer includes a trench that exposes aportion of the at least one inorganic layer, and the encapsulation layercontacts an exposed portion of the at least one inorganic layer via thetrench.

The trench may be disposed on a connection unit of the plurality ofconnection units.

The trench may extend across a width of the connection unit and may bealigned with a lateral surface of an island of the plurality of islands.

The trench may be on an island of the plurality of islands and maycompletely surround a display unit of the plurality of display units.

The at least one inorganic layer may include a first insulating layerbetween an active layer and a gate electrode of the thin filmtransistor, and a second insulating layer disposed on the gateelectrode. The trench may expose a portion of the first insulating layeror the second insulating layer.

The encapsulation layer may contact a lateral surface of an island ofthe plurality of islands.

The encapsulation layer may include at least one of tin fluorophosphatesglass, chalcogenide glass, tellurite glass, borate glass, and phosphateglass.

Each of the plurality of encapsulation layers may include at least oneinorganic layer and at least one organic layer. The at least oneinorganic layer may contact an exposed portion of the at least oneinorganic layer of the thin film transistor via the trench.

At least one of the at least one inorganic layer and the at least oneorganic layer may include silicon oxide including carbon and hydrogen.

Each of the plurality of encapsulation layers may include a firstinorganic layer, a second inorganic layer, and an organic layer betweenthe first inorganic layer and the second inorganic layer. At least oneof the first inorganic layer and the second inorganic layer may contacta lateral surface of the island and may contact an exposed portion ofthe at least one inorganic layer of the thin film transistor via thetrench.

A connection unit of the plurality of connection units may includeflexures disposed on at least a portion of the connection unit, and thesecond inorganic layer disposed on an outermost side of theencapsulation layer from among the first inorganic layer and the secondinorganic layer may extend over the flexures.

Each of the plurality of display units may include a display region anda non-display region around the display region, and a dam unitsurrounding at least a portion of the display region may be disposed inthe non-display region. The first inorganic layer and the secondinorganic layer may cover the dam unit and contact each other around thedam unit.

The thin film transistor may include an active layer, a gate electrode,a source electrode, and a drain electrode. The display device mayinclude a first electrode, a second electrode, and an intermediate layerincluding an organic emission layer between the first electrode and thesecond electrode. The first electrode may extend from one of the sourceelectrode and the drain electrode. Each of the plurality of displayunits may be disposed between the first electrode and the island and mayfurther include a color filter including a portion overlapped by thefirst electrode.

The plurality of islands and the plurality of connection units may beone body.

The plurality of islands may be repeated in a first direction and asecond direction that is different from the first direction. Fourconnection units may be connected to each of the plurality of islands.Four connection units connected to one island from among the pluralityof islands may extend in different directions and may be respectivelyconnected to four adjacent islands that surround the one island.

The four connection units may include a pair of first connection unitson opposite sides of the one island and each extending in the firstdirection, and a pair of second connection units on opposite sides ofthe one island and each extending in the second direction. A firstwiring unit may be disposed on the two first connection units, and asecond wiring unit may be disposed on the two second connection units.The first wiring unit and the second wiring unit may cross on the oneisland.

The first wiring unit may include a region curved in the seconddirection along a through hole of the plurality of through holes, andthe second wiring unit may include a region curved in the firstdirection along the through hole.

The thin film transistor may include an active layer, a gate electrode,a source electrode, and a drain electrode. The source electrode, thedrain electrode, the first wiring unit, and the second wiring unit mayinclude a same material.

The first wiring unit may include a first voltage line, a second voltageline, and at least one data line, and the second wiring unit may includeat least one scan line.

The display device may include a first electrode, a second electrode,and an intermediate layer between the first electrode and the secondelectrode and including an organic emission layer. The first voltageline may electrically connect first electrodes respectively included inthe plurality of display units and separated from one another to oneanother. The second voltage line may electrically connect secondelectrodes respectively included in the plurality of display units andseparated from one another to one another.

Two adjacent islands among the plurality of islands may be connected toeach other by one connection unit. Each of the two adjacent islandsconnected to the one connection unit and a direction in which the oneconnection unit extends may make an acute angle.

Each of the plurality of islands may have a quadrilateral shape, andfour corners of each of the plurality of islands may be directed in thefirst direction and the second direction.

The display apparatus may further include a first protection film and asecond protection film respectively disposed on an upper surface and alower surface of the substrate. The first protection film and the secondprotection film may include elongation sheets.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects will become apparent and more readilyappreciated from the following description of the embodiments, taken inconjunction with the accompanying drawings in which:

FIG. 1 is a schematic plan view of a display apparatus, according to anembodiment of the present disclosure;

FIG. 2 is a magnified plan view of a portion A of FIG. 1 , according toan embodiment;

FIG. 3 is a schematic plan view of a unit of FIG. 1 , according to anembodiment;

FIG. 4 is a cross-sectional view taken along line I-I′ of FIG. 3 ,according to an embodiment;

FIG. 5 is a cross-sectional view taken along line II-II′ of FIG. 3 ,according to an embodiment;

FIG. 6 is a cross-sectional view taken along line III-III′ of FIG. 3 ,according to an embodiment;

FIG. 7 is a cross-sectional view taken along line II-II′ of FIG. 3 ,according to another embodiment;

FIG. 8 is a schematic plan view of a unit of FIG. 1 , according toanother embodiment;

FIG. 9 is a cross-sectional view taken along line I-I′ of FIG. 3 ,according to another embodiment;

FIG. 10 is a cross-sectional view taken along line II-II′ of FIG. 3 ,according to another embodiment;

FIG. 11 is a cross-sectional view taken along line III-III′ of FIG. 3 ,according to another embodiment;

FIG. 12 is a cross-sectional view taken along line II-II′ of FIG. 3 ,according to another embodiment;

FIG. 13 is a cross-sectional view taken along line I-I′ of FIG. 3 ,according to another embodiment;

FIG. 14 is a cross-sectional view taken along line I-I′ of FIG. 3 ,according to yet another embodiment;

FIG. 15 is a magnified plan view of a portion A of FIG. 1 ;

FIG. 16 is a cross-sectional view taken along line VI-VI′ of FIG. 15 ,according to an embodiment;

FIG. 17 is a cross-sectional view taken along line VII-VII′ of FIG. 15 ,according to an embodiment;

FIG. 18 is a schematic cross-sectional view of a display apparatus,which is a modification of the display apparatus of FIG. 1 ;

FIG. 19 is a schematic cross-sectional view of a display apparatus,which is another modification of the display apparatus of FIG. 1 ; and

FIG. 20 is a magnified plan view of a portion A of FIG. 1 , according toanother embodiment.

DETAILED DESCRIPTION

The present disclosure allows for various changes and numerousembodiments, and particular embodiments will be illustrated in thedrawings and described in detail in the written description. However,this is not intended to limit the scope of the present disclosure toparticular modes of practice, and it is to be appreciated that allchanges, equivalents, and substitutes that do not depart from the spiritand technical scope of the present disclosure are encompassed in thepresent disclosure. In the following description of the presentdisclosure, a detailed description of disclosed embodiments is providedto clarify exemplary features of the present disclosure.

While such terms as “first”, “second”, etc., may be used to describevarious components, such components must not be limited to the aboveterms. The above terms may be used to distinguish one component fromanother.

The terms used in the present specification are merely used to describeparticular embodiments, and are not intended to limit the scope of thepresent disclosure. An expression used in a singular encompasses theexpression in a plural, unless it has a clearly different meaning in thecontext. In the drawings, components may be exaggerated, omitted, orschematically illustrated for convenience and clarity of explanation. Inother words, sizes and thicknesses of components in the drawings may notreflect actual sizes and thicknesses thereof.

One or more embodiments of the present disclosure will be describedbelow in more detail with reference to the accompanying drawings. Thosecomponents that are the same or are in correspondence are rendered thesame reference numeral regardless of the figure number, and redundantexplanations may be omitted.

FIG. 1 is a schematic plan view of a display apparatus 10, according toan embodiment of the present disclosure, and FIG. 2 is a magnified planview of a portion A of FIG. 1 , according to an embodiment.

Referring to FIG. 1 , the display apparatus 10 may include a substrate100 and display units 200 on the substrate 100.

The substrate 100 may include various materials. The substrate 100 mayinclude a material, such as glass, metal, or an organic material.

According to another embodiment, the substrate 100 may include aflexible material. For example, the substrate 100 may include a materialthat can be easily bent, folded, or rolled. The flexible substrate 100may include a flexible material such as ultra-thin glass, metal, orplastic. When the substrate 100 includes plastic, the substrate 100 mayinclude polyimide (PI). As another example, the substrate 100 mayinclude another type of plastic material.

The substrate 100 may include a plurality of islands 101 spaced apartfrom one another, a plurality of connection units 102 that areconnecting the plurality of islands 101 to one another, and a pluralityof through holes V penetrating through the substrate 100 between theplurality of connection units 102. As will be described with referenceto FIG. 18 , a first protection film 410 and a second protection film420 may be respectively disposed on an upper surface and a lower surfaceof the substrate 100.

The plurality of islands 101 may be arranged to be spaced apart from oneanother. For example, the plurality of islands 101 may be repeated in afirst direction X and a second direction Y that is different from thefirst direction X to form a planar lattice pattern. For example, thefirst direction X and the second direction Y may intersect at 90° angle.As another example, the first direction X and the second direction Y maymeet at either an acute or an obtuse angle.

A plurality of display units 200 may be disposed on the plurality ofislands 101, respectively. Each display unit 200 may include at least adisplay device to realize visible light. Each display unit 200 will bedescribed below in detail with reference to FIG. 4 .

The plurality of connection units 102 may connect the plurality ofislands 101 to one another. For example, four connection units 102 ofeach of the island 101 are extended to be connected to each of theadjacent islands 101 in different directions such that the fourconnection units 102 may be respectively connected to the four adjacentislands 101 surrounding the island 101. The plurality of islands 101 andthe plurality of connection units 102 may be formed of the same materialand may be connected to each other. In other words, the plurality ofislands 101 and the plurality of connection units 102 may be integrallyformed with each other.

The through holes V penetrate through the substrate 100. The throughholes V may provide separation areas between the plurality of islands101, reducing the weight of the substrate 100 while improving theflexibility of the substrate 100. When the substrate 100 is bent,rolled, or the like, the shapes of the through holes V change toeffectively reduce the stress generated during deformation of thesubstrate 100. Thus, abnormal deformation and stress concentration ofthe substrate 100 under deformation may be prevented, and durability ofthe substrate 100 may improve.

The through holes V may be formed by removing selective regions of thesubstrate 100 via etching or the like. As another example, the substrate100 may be manufactured to include the through holes V during themanufacture of the substrate 100. As another example, after theplurality of display units 200 are formed on the substrate 100, thethrough holes V may be formed by patterning the substrate 100. Thethrough holes V may be formed in the substrate 100 in various ways, anda method of forming the through holes V may not be limited to theexamples described herein.

Hereinafter, a unit U refers to the basic unit of the substrate 100, anda structure of the substrate 100 will be described in more detail withreference to the unit U.

The unit U may be repeated in the first direction X and the seconddirection Y. In other words, the substrate 100 may be understood as acombination of a plurality of units U repeated in the first direction Xand the second direction Y. Each unit U may include an island 101 and atleast one connection unit 102 connected to the island 101. For example,four connection units 102 may be connected to one island 101.

The islands 101 of two adjacent units U may be spaced apart from eachother, and connection units 102 of the two adjacent units U may beconnected to each other. A connection unit 102 included in a unit U maybe referred to as a partial region of the connection unit 102 that iswithin the unit U or may be referred to as the whole of a connectionunit 102 between two adjacent islands 101 that connects the two adjacentislands 101 to each other.

Four adjacent units U among the plurality of units U form closed curvesCL between the four units U, and the closed curves CL may define anempty space herein referred to as a through hole V. The through hole Vmay also be referred to as a separation area V. The separation area isformed by removing one region of the substrate 100, and may improve theflexibility of the substrate 100 while reducing stress that is generatedwhen the substrate 100 is deformed. Each connection unit 102 may have asmaller width than a width of each island 101, and the separation areamay contact the islands 101 of the four units U.

Two adjacent units U among the plurality of units U may be symmetricalto each other. In detail, as shown in FIG. 1 , one unit U may besymmetrical to another unit U adjacent to the one unit U in the seconddirection Y, about an axis of symmetry that is parallel to the firstdirection X. At the same time, one unit U may be symmetrical to anotherunit U adjacent to the one unit U in the first direction X, about anaxis of symmetry that is parallel to the second direction Y.

An angle θ between a direction in which a connection unit 102 extendsand a lateral surface of an island 101 to which the connection unit 102is connected may be an acute angle. For example, when each island 101 isa quadrilateral and is disposed such that each of the four cornersthereof is directed in the first direction X or the second direction Y,the connection units 102 may be connected to the island 101 at regionsadjacent to the four corners and may extend in a direction parallel tothe second direction Y or the first direction X. In other words, theconnection units 102 connected to the corners directed to the firstdirection X may be directed in the second direction Y or a direction −Ythat is opposite to the second direction Y, and the connection units 102connected to the corners directed in the second direction Y may bedirected in the first direction X or a direction −X that is opposite tothe first direction X.

Thus, each of the lateral surfaces of two adjacent islands 101 connectedto one connection unit 102 may respectively make acute angles with thedirection in which the connection unit 102 extends. Accordingly, theislands 101 may be densely arranged, and the areas of the separationareas may be maximized by minimizing the lengths of the connection units102. As shown in FIG. 2 , the substrate 100 may exhibit an elongationproperty.

FIG. 2 illustrates a shape of the substrate 100 before and after thesubstrate 100 is elongated both in the first direction X and the seconddirection Y. Referring to FIG. 2 , when the substrate 100 is elongated,the angles formed by the connection units 102 and the lateral surfacesof the islands 101 to which the connection units 102 are connectedincrease (θ<θ′), and thus the separation areas may enlarge. Accordingly,intervals between the islands 101 may increase, and thus the substrate100 may be elongated both in the first direction X and the seconddirection Y.

Since each connection unit 102 has a smaller width than a width of eachisland 101, a shape change corresponding to the increase of the angle θwhile an external force is applied to the substrate 100 may mainly occurin the connection units 102, and the shapes of the islands 101 may notsubstantially change during elongation of the substrate 100. Thus, thedisplay units 200 on the islands 101 may be stably maintained even whenthe substrate 100 is elongated, and accordingly the display apparatus 10may be suited for display apparatuses that require flexibility, forexample, bending display apparatuses, flexible display apparatuses, orstretchable display apparatuses.

Moreover, since stress concentrates on connecting portions of theconnection units 102 that are connected to the lateral surfaces of theislands 101 during elongation of the substrate 100, connecting regions Cof the connection units 102 may include curved surfaces to preventtearing or the like of the connection units 102 due to the concentrationof the stress.

FIG. 3 is a schematic plan view of a unit U of FIG. 1 , FIG. 4 is across-sectional view taken along line I-I′ of FIG. 3 , FIG. 5 is across-sectional view taken along line II-II′ of FIG. 3 , and FIG. 6 is across-sectional view taken along line III-III′ of FIG. 3 , according toan embodiment. FIG. 7 is a cross-sectional view taken along line II-II′of FIG. 3 , according to another embodiment. FIG. 8 is a schematic planview of another example of a unit U of FIG. 1 .

Referring to FIGS. 3-8 , a display unit 200 and an encapsulation layer300 encapsulating the display unit 200 may be on an island 101 of a unitU.

The display unit 200 may be located on the island 101 and may include adisplay region DA and a non-display region around the display region DA.In the display region DA, at least one organic light-emitting device 230emitting, for example, red (R), blue (B), green (G), or white (W) light,may be located. Herein, the organic light-emitting device 230 may bereferred to and described as the display device. However, embodiments ofthe present disclosure are not limited thereto, and the display unit 200may include various other types of display devices, such as a liquidcrystal display.

The display unit 200 may include one organic light-emitting device 230emitting red (R), blue (B), green (G), or white (W) light, and thus onedisplay unit 200 may form one sub-pixel. As another example, the displayunit 200 may include a plurality of organic light-emitting devices 230that emit different lights. For example, one display unit 200 may form apixel by including an organic light-emitting device 230 emitting red (R)light, an organic light-emitting device 230 emitting green (G) light,and an organic light-emitting device 230 emitting blue (B) light. Asanother example, the display unit 200 may include a plurality of pixels.

Organic light-emitting devices 230 within the display unit 200 may bearranged in various configurations, such as an RGB configuration, apentile structure, and a honeycomb structure, depending on theefficiency of a material included in an organic emission layer.

Referring to FIG. 4 , a buffer layer 202 may be formed on the island101. For example, the buffer layer 202 may be formed of an inorganicmaterial (e.g., silicon oxide, silicon nitride, silicon oxynitride,aluminum oxide, aluminum nitride, titanium oxide, and titanium nitride),an organic material (e.g., polyimide, polyester, and acryl), or stacksof inorganic and organic materials. The buffer layer 102 may be formedon both the island 101 and the connection unit 102.

A thin film transistor TFT may include an active layer 203, a gateelectrode 205, a source electrode 207, and a drain electrode 208. A caseof a top gate type thin film transistor TFT in which the active layer203, the gate electrode 205, the source electrode 207, and the drainelectrode 208 are sequentially formed in the stated order will now bedescribed. However, the present embodiment is not limited thereto, andvarious types of thin film transistors TFT, such as a bottom gate typethin film transistor TFT, may be employed.

The active layer 203 may include a semiconductor material, for example,amorphous silicon or polycrystalline silicon. However, the presentembodiment is not limited thereto, and the active layer 203 may includevarious materials. According to another embodiment, the active layer 203may include an organic semiconductor material or the like. According toanother embodiment, the active layer 203 may include an oxidesemiconductor material. For example, the active layer 203 may include anoxide of a material selected from Group 12, 13, and 14 metal elements(e.g., zinc (Zn), indium (In), gallium (Ga), stannum (Sn), cadmium (Cd),and germanium (Ge)) and a combination thereof.

A first insulating layer 204 may be formed on the active layer 203. Thefirst insulating layer 204 may be formed of an inorganic material, suchas silicon oxide and/or silicon nitride, in a multi-layer structure or asingle-layer structure. The first insulating layer 204 insulates theactive layer 203 from the gate electrode 205. The first insulating layer204 may be formed on both the island 101 and the connection unit 102.

The gate electrode 205 may be formed on the first insulating layer 204to overlap the active layer 203. The gate electrode 205 may be connectedto a gate line (not shown) that applies an ON/OFF signal to the thinfilm transistor TFT. The gate electrode 205 may include a low resistancemetal material. The gate electrode 205 may be formed of at least one ofaluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium(Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium(Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), andcopper (Cu) in a single-layered or a multi-layered structure.

A second insulating layer 206 may be formed on the gate electrode 205and the first insulating layer 204. The second insulating layer 206insulates the source electrode 207 and the drain electrode 208 from thegate electrode 205. The second insulating layer 206 may be formed of aninorganic material in a multi-layer structure or a single-layerstructure. For example, the inorganic material may be metal oxide ormetal nitride. In detail, the inorganic material may include siliconoxide (SiO₂), silicon nitride (SiNx), silicon oxynitride (SiON),aluminum oxide (Al₂O₃), titanium oxide (TiO₂), tantalum oxide (Ta₂O₅),hafnium oxide (HfO₂), zirconium oxide (ZrO₂), or the like.

According to another embodiment, the second insulating layer 206 may bea single layer formed of an organic material, or may be a multi-layerstructure including a plurality of organic material layers. The organicmaterial may include a commercial polymer such as polymethylmethacrylate (PMMA) or polystyrene (PS), a polymer derivative having aphenol-based group, an acryl-based polymer, an imide-based polymer, anacryl ether-based polymer, an amide-based polymer, a fluorine-basedpolymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, ablend thereof, or the like. A passivation layer 209 may be a stack of aninorganic insulation layer and an organic insulation layer.

The second insulating layer 206 may be formed on both the island 101 andthe connection unit 102.

The source electrode 207 and the drain electrode 208 are formed on thesecond insulating layer 206. The source electrode 207 and the drainelectrode 208 may be formed of at least one selected from a groupincluding aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag),magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir),chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten(W), and copper (Cu) in a single-layered or a multi-layered structure.The source electrode 207 and the drain electrode 208 contact the activelayer 203 via contact holes formed in the second insulating layer 206and the first insulating layer 204.

The passivation layer 209 may cover the thin film transistor TFT. Thepassivation layer 209 may planarize steps caused by the thin filmtransistor TFT, thereby preventing the organic light-emitting device 230from being damaged by unevenness.

The passivation layer 209 may be a single layer formed of an organicmaterial, or may be a multi-layer structure including a plurality oforganic material layers. The organic material may include a commercialpolymer such as PMMA or PS, a polymer derivative having a phenol-basedgroup, an acryl-based polymer, an imide-based polymer, an acrylether-based polymer, an amide-based polymer, a fluorine-based polymer, ap-xylene-based polymer, a vinyl alcohol-based polymer, a blend thereof,or the like. The passivation layer 209 may be a stack of an inorganicinsulation layer and an organic insulation layer.

The passivation layer 209 may be formed on both the island 101 and theconnection unit 102. The passivation layer 209 on the connection unit102 may include a trench T exposing an inorganic layer under thepassivation layer 209. The inorganic layer that is exposed under thepassivation layer 209 may be the buffer layer 202, the first insulatinglayer 204, and/or the second insulating layer 206.

The trench T may extend across the width of the connection unit 102.Accordingly, the trench T may reduce or prevent infiltration of externalmoisture into the display unit 200 via the passivation layer 209 formedof an organic material.

For example, as shown in FIG. 3 , the trench T may extend across thewidth of the connection unit 102, in a connecting region C where theisland 101 and the connection unit 102 are connected to each other, andmay be aligned with a lateral surface of the island 101. In detail, anextension of the lateral surface of the island 101 may be within thewidth of the trench T.

As another example, as shown in FIG. 8 , a trench T′ may be disposed onthe island 101 to completely surround the display unit 200. Accordingly,separate passivation layers 209 may be formed on each of the islands101, respectively.

The organic light-emitting device 230 is formed on the passivation layer209. The organic light-emitting device 230 may include a first electrode231, a second electrode 232 opposite to the first electrode 231, and anintermediate layer 233 between the first electrode 231 and the secondelectrode 232.

The first electrode 231 may be electrically connected to either thesource electrode 207 or the drain electrode 208. The first electrode 231may have various shapes. For example, the first electrode 231 may bepatterned to have an island shape.

The first electrode 231 may be formed on the passivation layer 209 andmay be electrically connected to the thin film transistor TFT via acontact hole formed in the passivation layer 209. For example, the firstelectrode 231 may be a reflection electrode including a reflection layerformed of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt),palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir),chromium (Cr), or a compound thereof. In another example, the firstelectrode 231 may include a transparent electrode layer on thereflection layer. The transparent electrode layer may include at leastone selected from a group including indium tin oxide (ITO), indium zincoxide (IZO), zinc oxide (ZnO), indium oxide (In₂O₃), indium galliumoxide (IGO), and aluminum zinc oxide (AZO).

The second electrode 232 may be electrically connected to a secondvoltage line V2 and may receive a second voltage ELVSS that is lowerthan a first voltage ELVDD that is applied to the first electrode 231.Although the second voltage line V2 and the second electrode 232 areshown to be connected to each other via a connection line 216 shown inFIG. 6 , embodiments of the present disclosure are not limited thereto.For example, the second voltage line V2 and the second electrode 232 maydirectly contact each other.

The second electrode 232 may have various shapes. For example, thesecond electrode 232 may be patterned to have an island shape. Thus, aportion of the second electrode 232 may be prevented from being exposedeven when the second electrode 232 is completely covered with theencapsulation layer 300, and encapsulation layers 300 are respectivelyformed on the islands 101.

The second electrode 232 may be a transparent electrode. The secondelectrode 232 may include a metal thin film including Li, Ca, LiF/Ca,LiF/Al, Al, Ag, Mg, or a combination thereof. An auxiliary electrodelayer or a bus electrode may be further formed on the metal thin film.The auxiliary electrode layer or the bus electrode may include amaterial such as ITO, IZO, ZnO, or In₂O₃. Accordingly, the secondelectrode 232 may transmit light emitted by an organic emission layerincluded in the intermediate layer 233. In other words, the lightemitted by the organic emission layer may travel directly toward thesecond electrode 232, or may be reflected by the first electrode 231that is formed as the reflection electrode and then travel toward thesecond electrode 232.

In the example described above with reference to FIGS. 3-8 , the displayunit 200 is of a top-emission type. However, the display unit 200according to another embodiment is not limited to the top-emission type.According to another embodiment, the display unit 200 may be abottom-emission type in which the light emitted by the organic emissionlayer is emitted toward the island 101. In this case, the firstelectrode 231 may be a transparent electrode, and the second electrode232 may be a reflection electrode. The display unit 200 according to yetanother embodiment may be of a dual emission type that emits light inboth directions toward the top surface and the bottom surface of thedisplay unit 200.

A pixel defining layer 219 including an insulating material is formed onthe first electrode 231. The pixel defining layer 219 may be formed ofat least one organic insulating material selected from the groupincluding polyimide, polyamide (PA), acryl resin, benzocyclobutene (BCB)and a phenolic resin, by using a method such as spin coating. The pixeldefining layer 219 exposes an area of the first electrode 231. Theintermediate layer 233 including an organic emission layer is formed onthe exposed area of the first electrode 231. In other words, the pixeldefining layer 219 defines a pixel region of an organic light-emittingdevice.

The intermediate layer 233 may further include one or more functionallayers, such as a hole transport layer (HTL), a hole injection layer(HIL), an electron transport layer (ETL), and an electron injectionlayer (EIL), in addition to the organic emission layer.

The encapsulation layer 300 encapsulating the display unit 200 may beformed on the second electrode 232. The encapsulation layer 300 mayblock external oxygen and moisture and may include a single layer or aplurality of layers.

The encapsulation layer 300 may include at least one of an organic layerand an inorganic layer.

The organic layer may include PMMA, polycarbonate (PC), PS, acryl-basedresin, epoxy-based resin, polyimide, and/or polyethylene. The inorganiclayer may include at least one selected from a group including siliconnitride, aluminum nitride, zirconium nitride, titanium nitride, hafniumnitride, tantalum nitride, silicon oxide, aluminum oxide, titaniumoxide, tin oxide, cerium oxide, and silicon oxynitride (SiON).

According to another embodiment, the encapsulation layer 300 may includea Low temperature Viscosity Transition (LVT) inorganic material. Aviscosity transition temperature denotes a minimum temperature at whichfluidity can be provided to an LVT inorganic material. The viscositytransition temperature may be less than a denaturalization temperatureof a material included in the organic light-emitting device 230.

The LVT inorganic material may be, for example, a low liquidustemperature (LLT) material having a glass transition temperature of 200°C. or less. In more detail, an LLT material may include at least one oftin fluorophosphates glass, chalcogenide glass, tellurite glass, borateglass, and phosphate glass.

For example, the tin fluorophosphates glass may include, but is notlimited to, Sn of 20-80% by weight, phosphorus (P) of 2-20% by weight,oxygen (O) of 3-20% by weight, and fluorine (F) of 10-36% by weight. Theaforementioned glass materials may further include tungsten (W). Whentungsten (W) is added to a glass material, a more stable and uniformglass can be produced, and thus the encapsulation layer 300 may haveimproved chemical durability.

The LVT inorganic material may include Sn oxide (e.g., SnO or SnO₂). Forexample, when the LVT inorganic material includes SnO, SnO content maybe 20% to 100% by weight.

The LVT inorganic material including Sn oxide may further include, butis not limited to, at least one of P oxide (e.g., P₂O₅), boron (B)phosphate (BPO₄), Sn fluoride (e.g., SnF₂), niobium oxide (e.g., NbO),and W oxide (e.g., WO₃).

For example, the LVT inorganic material may include, but is not limitedto, SnO; SnO and P₂O₅; SnO and BPO₄; SnO, SnF₂ and P₂O₅; SnO, SnF₂, P₂O₅and NbO; or SnO, SnF₂, P₂O₅ and WO₃.

The LVT inorganic material may have, but is not limited to, any of thefollowing compositions:

-   -   1 SnO (100 wt %);    -   2 SnO (80 wt %) and P₂O₅ (20 wt %);    -   3 SnO (90 wt %) and BPO₄ (10 wt %);    -   4 SnO (20-50 wt %), SnF₂ (30-60 wt %) and P₂O₅ (10-30 wt %)        (where a sum of the weights of SnO, SnF₂, and P₂O₅ is 100 wt %);    -   5 SnO (20-50 wt %), SnF₂ (30-60 wt %), P₂O₅ (10-30 wt %) and NbO        (1-5 wt %) (where a sum of the weights of SnO, SnF₂, P₂O₅ and        NbO is 100 wt %); or    -   6 SnO (20-50 wt %), SnF₂ (30-60 wt %), P₂O₅ (10-30 wt %) and WO₃        (1-5 wt %) (where a sum of the weights of SnO, SnF₂, P₂O₅ and        WO₃ is 100 wt %).

Since such an encapsulation layer 300 is formed of a glass material,even when the encapsulation layer 300 does not include a plurality oflayers, the encapsulation layer 300 may effectively prevent infiltrationof external moisture and oxygen.

The encapsulation layer 300 may be formed on one island 101 toencapsulate one display unit 200. In other words, when the displayapparatus 10 of FIG. 1 includes N display units 200, N encapsulationlayers 300 may be formed. Thus, the encapsulation layer 300 is preventedfrom being damaged, for example, cracked, when the display apparatus 10is elongated or when the display apparatus 10 is deformed due tobending, rolling, or the like, thereby improving the reliability andflexibility of the display apparatus 10.

The encapsulation layer 300 may contact an exposed portion of aninorganic layer of the display unit 200 in the non-display region of thedisplay unit 200. In this case, the inorganic layer of the display unit200 may be at least one of the buffer layer 202, the first insulatinglayer 204, and the second insulating layer 206. The encapsulation layer300 may further extend beyond the island 101 and may contact the lateralsurface of the island 101. Thus, the encapsulation layer 300 mayeffectively prevent infiltration of external moisture and/or oxygen.

The encapsulation layer 300 may contact the exposed portion of theinorganic layer including at least one of the buffer layer 202, thefirst insulating layer 204, and the second insulating layer 206 via thetrench T.

For example, as shown in FIG. 5 , when the second insulating layer 206is formed of an inorganic material, the encapsulation layer 300 maycontact an exposed portion of the second insulating layer 206 via thetrench T. As another example, as shown in FIG. 7 , when the secondinsulating layer 206 is formed of an organic material and the firstinsulating layer 204 below the second insulating layer 206 is formed ofan inorganic material, a trench T may be formed to expose a portion ofthe first insulating layer 204, and the encapsulation layer 300 maycontact the exposed portion of the first insulating layer 204 via thetrench T.

The trench T may be aligned with the lateral surface of the island 101.The display unit 200 is entirely surrounded and encapsulated by theencapsulation layer 300 and the inorganic layer having an isolatedstate, therefore infiltration of external moisture and/or oxygen intothe display unit 200 may be effectively reduced or prevented.

As another example, as shown in FIG. 8 , when the trench T′ is formed onthe island 101 and completely surrounds the display unit 200, theencapsulation layer 300 may contact an exposed portion of the firstinsulating layer 204 or the second insulating layer 206 via the trenchT′ and thus may effectively reduce or prevent infiltration of externalmoisture and/or oxygen.

FIG. 9 is a cross-sectional view taken along line I-I′ of FIG. 3 FIG. 10is a cross-sectional view taken along line II-II′ of FIG. 3 , and FIG.11 is a cross-sectional view taken along line III-III′ of FIG. 3 ,according to another embodiment.

Referring to FIGS. 3 and 9-11 , a display unit 200 and an encapsulationlayer 310 are formed on an island 101. The display unit 200 may includeat least one organic light-emitting device 230 and a thin filmtransistor TFT that is electrically connected to the organiclight-emitting device 230. Since the island 101 and the display unit 200are the same as those described above with reference to FIGS. 1-8 ,repeated descriptions thereof may be omitted, and only differencestherebetween will now be focused.

One encapsulation layer 310 may be formed on one island 101 toencapsulate one display unit 200.

The encapsulation layer 310 may include, for example, at least oneinorganic layer (i.e., inorganic layers 312 and 314) and at least oneorganic layer (i.e., an organic layer 316) that are alternately stackedone on another. Although the encapsulation layer 310 includes the twoinorganic layers 312 and 314 and the single organic layer 316 in FIGS.9-11 , embodiments of the present disclosure are not limited thereto.For example, the encapsulation layer 310 may further include a pluralityof additional inorganic layers and a plurality of additional organiclayers that are alternately stacked one on another, and the number ofstacked inorganic layers and the number of stacked organic layers arenot limited. As described above with reference to FIG. 4 , theencapsulation layer 310 may be formed of an LVT inorganic material ormay include a layer formed of an LVT inorganic material.

According to an embodiment, the inorganic layers 312 and 314 may includeat least one selected from a group including silicon nitride, aluminumnitride, zirconium nitride, titanium nitride, hafnium nitride, tantalumnitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide,cerium oxide, and silicon oxynitride (SiON).

The organic layer 316 may planarize steps caused by the pixel defininglayer 219 and may reduce stress generated on the inorganic layers 312and 314. According to an embodiment, the organic layer 316 may includeat least one selected from a group including PMMA, PC, PS, acryl-basedresin, epoxy-based resin, polyimide, and polyethylene.

According to anther embodiment, the organic layer 316 may includesilicon oxide including carbon and oxygen (hereinafter, referred to asSiOCH). For example, the organic layer 316 may be formed of a materialhaving a composition formula of SiO_(x)C_(y)H_(z).

When the organic layer 316 is formed of SiOCH, the organic layer 316 maybe formed by forming a precursor film on the first inorganic layer 312via plasma enhanced chemical vapor deposition (PECVD) by using a rawmaterial gas (e.g., hexamethyldisiloxane) and a reaction gas (e.g.,oxygen) and then plasma-curing the precursor film. The organic layer 316and the inorganic layers 312 and 314 may be formed using the same methodwithin the same chamber to reduce a tack time during formation of theencapsulation layer 310.

According to another embodiment, at least one of the inorganic layers312 and 314 may include SiOCH. For example, at least one of theinorganic layers 312 and 314 may include a material having a compositionformula of SiO_(x)′C_(y)′H_(z)′.

When the organic layer 316 and at least one of the inorganic layers 312and 314 are all formed of SiOCH, a composition ratio of SiOCH used toform the at least one of the inorganic layers 312 and 314 may bedifferent from that of SiOCH used to form the organic layer 316. Indetail, since a film formed of SiOCH has a similar property to aninorganic layer as an oxygen content ratio increases and a carboncontent ratio decreases, oxygen content of SiOCH used to form at leastone of the inorganic layers 312 and 314 may be more than that of SiOCHused to form the organic layer 316, and carbon content of SiOCH used toform at least one of the inorganic layers 312 and 314 may be less thanthat of SiOCH used to form the organic layer 316.

The oxygen and carbon contents of SiOCH may be adjusted duringproduction of an SiOCH film. For example, the SiOCH film may be formedvia PECVD by using a raw material gas (e.g., hexamethyldisiloxane) and areaction gas (e.g., oxygen). In this case, when a flow ratio of oxygenas a reaction gas is increased, the oxygen content of the SiOCH film maybe increased and the carbon content thereof may be decreased.

As such, when the organic layer 316 and at least one of the inorganiclayers 312 and 314 are all formed of SiOCH, the inorganic layers 312 and314 and the organic layer 316 may be consecutively formed within thesame chamber by simply adjusting the flow rate of the reaction gas,leading to an improvement in the manufacturing efficiency of theencapsulation layer 310.

According to one embodiment, the inorganic layers 312 and 314 may havelarger areas than the organic layer 316. The inorganic layers 312 and314 may contact each other, around the organic layer 316. At least oneof the inorganic layers 312 and 314 may contact the inorganic layer ofthe display unit 200 in the non-display region of the display unit 200.In this case, the inorganic layer may be the buffer layer 202, the firstinsulating layer 204, or the second insulating layer 206. At least oneof the inorganic layers 312 and 314 may further extend beyond the island101 and may contact a lateral surface of the island 101. Accordingly,bonding strength of the encapsulation layer 310 may improve, and theencapsulation layer 310 may effectively prevent infiltration of externalmoisture and/or oxygen into the display unit 200.

The buffer layer 202, the first insulating layer 204, the secondinsulating layer 206, and the passivation layer 209 of the display unit200 may be formed on the connection unit 102, and the passivation layer209 on the connection unit 102 may include a trench T exposing a portionof the first insulating layer 204 or the second insulating layer 206under the passivation layer 209. In this case, at least one of theinorganic layers 312 and 314 may contact the exposed portion of thefirst insulating layer 204 or the second insulating layer 206 via thetrench T.

According to another embodiment, a dam unit D surrounding at least aportion of the display region DA of the display unit 200 may be formedin the non-display region of the display unit 200.

For example, the dam unit D may include a first layer formed of thematerial used to form the passivation layer 209, and a second layerformed of the material used to form the pixel defining layer 219.However, embodiments of the present disclosure are not limited thereto,and the dam unit D may include a single layer. According to someembodiments, a plurality of dam units D may be included. When aplurality of dam units D are included, each of the dam units D has aheight increasing in a direction toward the edge of the island 101.

The dam unit D may include the same material used to form at least oneof the layers between the first insulating layer 204 and the pixeldefining layer 219.

During formation of the organic layer 316 of the encapsulation layer310, the dam unit D may block an organic material or the like used toform the organic layer 316 from flowing toward the edge of the island101, thereby preventing formation of an edge tail of the organic layer316. Thus, the organic layer 316 may face or contact an inner surface ofthe dam unit D. As another example, the organic layer 316 may overlap aportion of the dam unit D, but may not extend beyond the dam unit D.

However, the first inorganic layer 312 and the second inorganic layer314 may contact each other around the dam unit D, and at least one ofthe first inorganic layer 312 and the second inorganic layer 314 maycontact an exposed portion of the first insulating layer 204 or thesecond insulating layer 206 via the trench T and may also contact alateral surface of the island 101. Accordingly, bonding strength of theencapsulation layer 310 may improve, and the encapsulation layer 310 mayeffectively prevent infiltration of external moisture and/or oxygen intothe display unit 200.

FIG. 12 is a cross-sectional view taken along line II-II′ of FIG. 3 ,according to another embodiment.

Referring to FIG. 12 , a display unit 200 may be formed on the island101. The display unit 200 may include the thin film transistor TFT ofFIG. 4 including inorganic layers and the organic light-emitting device230 of FIG. 4 that is electrically connected to the thin film transistorTFT. The passivation layer 209 may be interposed between the thin filmtransistor TFT and the organic light-emitting device 230. The inorganiclayers of the thin film transistor TFT may be the first insulating layer204 and the second insulating layer 206.

The buffer layer 202, the first insulating layer 204, the secondinsulating layer 206, and the passivation layer 209 formed on the island101 may extend over the connection unit 102. The passivation layer 209on the connection unit 102 may include a trench T exposing a portion ofthe first insulating layer 204 or the second insulating layer 206 underthe passivation layer 209.

At least one of the inorganic layers 312 and 314 of the encapsulationlayer 310 may contact the exposed portion of the first insulating layer204 or the second insulating layer 206 via the trench T.

According to one embodiment, a dam unit D surrounding at least a portionof the display region DA of the display unit 200 may be formed in thenon-display region of the display unit 200. The organic layer 316 mayface or contact an inner surface of the dam unit D or may overlap aportion of the dam unit D, but may not extend beyond the dam unit D.However, the inorganic layers 312 and 314 may cover the dam unit D andmay contact each other around the dam unit D.

According to one embodiment, an outermost inorganic layer of theencapsulation layer 310 may extend over the connection unit 102. Forexample, when the encapsulation layer 310 includes the two inorganiclayers 312 and 314, the second inorganic layer 314 on the outermost sideof the encapsulation layer 310 may be formed on both the island 101 andthe connection unit 102.

In other words, the passivation layer 209 formed on the connection unit102 may be covered with the second inorganic layer 314. Since thepassivation layer 209 may be formed of an organic material as describedabove, when the passivation layer 209 formed on the connection unit 102is covered with the second inorganic layer 314 formed of an inorganicmaterial, exposure of a surface of the passivation layer 209 to oxygenor moisture may be prevented, and thus infiltration of oxygen ormoisture into the display unit 200 via the passivation layer 209 may beprevented.

According to one embodiment, flexures P may be formed on at least aportion of the region on the connection unit 102. For example, theflexures P may be formed by patterning the passivation layer 209. Asanother example, the flexures P may be formed using various methods,such as, by forming steps or the like on the connection unit 102. Amethod of forming the flexures P is not limited thereto.

The flexures P may be formed at a location corresponding to theconnection region C of FIG. 3 where the island 101 and the connectionunit 102 are connected to each other. The flexures P may reduce stressthat may concentrate on a connecting portion between the connection unit102 and the island 101 during elongation of the substrate 10 of FIG. 1 .The flexures P may prevent the second inorganic layer 314 extending overthe connection unit 102 from being damaged, for example, cracked.

FIG. 13 is a cross-sectional view taken along line I-I′ of FIG. 3 ,according to another embodiment.

Referring to FIG. 13 , a display unit 200′ may be disposed on the island101, and may include a source electrode 2111, a drain electrode 2112, anactive layer 2130, an organic light-emitting device 2125, a gateelectrode 2140, a light protection layer 2105, a color filter 2106, andan auxiliary electrode 2150. For convenience of explanation, FIG. 13does not show an encapsulation layer on the display unit 200′. However,the display unit 200′ may be encapsulated by an encapsulation layer.

The island 101 may include the same material as the materials mentionedin the previous embodiments. A buffer layer 2102 may be formed on theisland 101.

The source electrode 2111 and the drain electrode 2112 may be formed onthe buffer layer 2102. A first electrode 2120 of the organiclight-emitting device 2125 may also be formed on the buffer layer 2102.In other words, the first electrode 2120 may extend from the sourceelectrode 2111 or the drain electrode 2112. In other words, the firstelectrode 2120 may include the same material used to form the sourceelectrode 2111 or the drain electrode 2112, and may be integrally formedwith the source electrode 2111 or the drain electrode 2112. Thus,process efficiency of the display unit 200′ may improve.

The active layer 2130 may be formed on the source electrode 2111 and thedrain electrode 2112. The active layer 2130 corresponds to a spacebetween the source electrode 2111 and the drain electrode 2112.

According to another embodiment, the active layer 2130 may contact thesource electrode 2111 and the drain electrode 2112, and, in particular,may contact respective lateral surfaces of the source electrode 2111 andthe drain electrode 2112 that face each other. For example, the activelayer 2130 may contact a lateral surface facing the drain electrode 2112from among the lateral surfaces of the source electrode 2111 and maycontact a lateral surface facing the source electrode 2111 from amongthe lateral surfaces of the drain electrodes 2112. According to anotherembodiment, the active layer 2130 may contact a portion of the uppersurface of the source electrode 2111 and a portion of the upper surfaceof the drain electrode 2112. Accordingly, contact areas between theactive layer 2130 and the source electrode 2111 and the drain electrode2112 increase, and thus a short channel structure may be implemented.

The active layer 2130 may include various materials. For example, theactive layer 2130 may include an oxide semiconductor material. Accordingto another embodiment, the active layer 2130 may include a ZnO-basedoxide. According to yet another embodiment, the active layer 2130 mayinclude an oxide semiconductor material containing In, Ga, and/or Sn.

According to yet another embodiment, the active layer 2130 may includeG-I-Z-O [(In₂O₃)a(Ga₂O₃)b(ZnO)c], wherein a, b, and c are real numbersthat respectively satisfy a≥0, b≥0, and c>0.

According to yet another embodiment, the active layer 2130 may includean oxide of a material selected from Group 12, 13, and 14 metal elements(e.g., zinc (Zn), indium (In), gallium (Ga), stannum (Sn), cadmium (Cd),germanium (Ge), and hafnium (Hf)), and a combination thereof.

The gate electrode 2140 has a region that overlaps at least a portion ofthe active layer 2130. The gate electrode 2140 may include varioushighly-conductive materials. According to another embodiment, the gateelectrode 2140 may include a low resistance metal material, for example,molybdenum (Mo), aluminum (Al), copper (Cu), or titanium (Ti).

A first insulation layer 2135 is formed between the gate electrode 2140and the active layer 2130. The first insulation layer 2135 electricallyinsulates the gate electrode 2140 from the active layer 2130.

The first insulating layer 2135 may not cover at least one region of thefirst electrode 2120. According to another embodiment, the firstinsulating layer 2135 may cover at least an edge of the first electrode2120.

The gate electrode 2140 is formed on the first insulating layer 2135.The first insulating layer 2135 may include various insulatingmaterials. For example, the first insulating layer 2135 may include aninorganic material, such as silicon oxide, silicon nitride, or aluminumoxide. As another example, the first insulating layer 2135 may includean organic material including a polymer.

A second insulation layer 2144 is formed on the gate electrode 2140. Thesecond insulating layer 2144 covers the gate electrode 2140. The secondinsulating layer 2144 is formed on the first insulating layer 2135. Thesecond insulating layer 2144 may not cover at least one region of thefirst electrode 2120.

According to another embodiment, the second insulating layer 2144 maycover the first insulating layer 2135, in a region corresponding to anupper surface of the first electrode 2120.

According to another embodiment, at least a portion of the firstinsulating layer 2135 may be exposed without being covered with thesecond insulating layer 2144, in the region corresponding to the uppersurface of the first electrode 2120.

The second insulating layer 2144 may include various insulatingmaterials. For example, the second insulating layer 2144 may include aninorganic material, such as silicon oxide, silicon nitride, or aluminumoxide. As another example, the second insulating layer 2144 may includean organic material including a polymer.

The auxiliary electrode 2150 may be formed on the second insulatinglayer 2144. The auxiliary electrode 2150 contacts at least a portion ofone of the source electrode 2111 and the drain electrode 2112. The firstinsulating layer 2135 and the second insulating layer 2144 may expose atleast one region of at least one of the source electrode 2111 and thedrain electrode 2112, and the auxiliary electrode 2150 may contact theexposed region.

The auxiliary electrode 2150 may not face at least a portion of theentire region of the first electrode 2120 that is not covered with thefirst insulating layer 2135 and the second insulating layer 2144.

The auxiliary electrode 2150 improves electrical characteristics of thesource electrode 2111 and the drain electrode 2112. In particular, whenthe source electrode 2111 and the drain electrode 2112 are formed of alight transmitting material, electrical resistances of the sourceelectrode 2111 and the drain electrode 2112 may increase. This problemmay be compensated by forming the auxiliary electrode 2150 of a materialhaving low resistivity to improve electrical properties of the sourceelectrode 2111 and the drain electrode 2112.

The auxiliary electrode 2150 may include various conductive materials,for example, a highly-conductive metal material. According to anotherembodiment, the auxiliary electrode 2150 may include Cu, Ag, Al, Mo, orAu. According to one embodiment, the auxiliary electrode 2150 is formedto be spaced apart from the active layer 2130 to prevent a component ofthe auxiliary electrode 2150 from being diffused into the active layer2130 and damaging the active layer 2130.

According to one embodiment, the auxiliary electrode 2150 may be formedon a different level from the level of the gate electrode 2140 on thesecond insulating layer 2144, thereby minimizing interference in thegate electrode 2140 and enabling precise patterning of the gateelectrode 2140 and the auxiliary electrode 2150. However, according toanother embodiment, the auxiliary electrode 2150 may be formed on thefirst insulating layer 2135 on the same level as that of the gateelectrode 2140.

A passivation layer 2145 is formed on the second insulating layer 2144.The passivation layer 2145 covers the auxiliary electrode 2150. Thepassivation layer 2145 may not cover at least one region of the firstelectrode 2120.

According to one embodiment, the passivation layer 2145 may cover thesecond insulating layer 2144 in the region corresponding to the uppersurface of the first electrode 2120. According to another embodiment, atleast a portion of the second insulating layer 2144 may be exposedwithout being covered with the passivation layer 2145 in the regioncorresponding to the upper surface of the first electrode 2120.

The passivation layer 2145 may be a single layer formed of an organicmaterial, or may be a multi-layer structure including a plurality oforganic material layers. The organic material may include a commercialpolymer such as PMMA or PS, a polymer derivative having a phenol-basedgroup, an acryl-based polymer, an imide-based polymer, an acrylether-based polymer, an amide-based polymer, a fluorine-based polymer, ap-xylene-based polymer, a vinyl alcohol-based polymer, a blend thereof,or the like. The passivation layer 2145 may be a stack of an inorganicinsulation layer and an organic insulation layer.

The first insulating layer 2135, the second insulating layer 2144, andthe passivation layer 2145 may also be formed on the connection unit 102of FIG. 3 . The first insulating layer 2135 or the second insulatinglayer 2144 may be exposed via the trench T of FIG. 3 . The exposed firstinsulating layer 2135 or the exposed second insulating layer 2144 maycontact the encapsulation layer 300 of FIG. 3 .

An intermediate layer 2123 is formed on an upper surface of the firstelectrode 2120. The intermediate layer 2123 may include an organicemission layer to generate visible light. The intermediate layer 2123may generate various colors of lights. In other words, the intermediatelayer 2123 may generate red (R), green (G), and blue (B) lights, forexample. According to another embodiment, the intermediate layer 2123may generate white (W) light.

A second electrode 2122 is formed on the intermediate layer 2123. Thesecond electrode 2122 may include various conductive materials, forexample, Li, Ca, LiF/Ca, LiF/Al, Al, Mg, and Ag.

The light protection layer 2105 faces the active layer 2130. The lightprotection layer 2105 may face a surface opposite to a surface facingthe gate electrode 2140 among the surfaces of the active layer 2130.Accordingly, the active layer 2130 may be prevented from being damagedby light.

According to one embodiment, an over-coating layer 2103 may be formed ona substrate to cover the light protection layer 2105. The over-coatinglayer 2103 may be formed below the buffer layer 2102.

The color filter 2106 faces at least one region of the first electrode2120. In detail, the color filter 2106 may face a region of the firstelectrode 2120 that is overlapped by the intermediate layer 2123. Thecolor filter 2106 may be disposed between the first electrode 2120 andthe substrate.

According to one embodiment, the color filter 2106 may be formed on thesubstrate, and the over-coating layer 2103 may be formed to cover thecolor filter 2106. The over-coating layer 2103 may be formed below thebuffer layer 2102.

The color filter 2106 may face the first electrode 2120, and thus adisplay apparatus generating various colors may be realized.

While the color filter 2106 is being formed, the light protection layer2105 may also be formed of a color filter material based on one color,for example, a red (R) color. In other words, after the light protectionlayer 2105 and the color filter 2106 are formed on the substrate, theover-coating layer 2103 may be formed to cover the light protectionlayer 2105 and the color filter 2106.

FIG. 14 is a cross-sectional view taken along line I-I′ of FIG. 3 ,according to yet another embodiment.

Referring to FIGS. 3 and 14 , a display unit 200 may be disposed on theisland 101, and may include at least one organic light-emitting device230 and a thin film transistor TFT that is electrically connected to theorganic light-emitting device 230. The organic light-emitting device 230may include a first electrode 231, an intermediate layer 233, and asecond electrode 232. A passivation layer 209 may be disposed betweenthe organic light-emitting device 230 and the thin film transistor TFT.For convenience of explanation, FIG. 14 does not show an encapsulationlayer on the display unit 200. However, the display unit 200 may beencapsulated by an encapsulation layer.

A pixel defining layer 219 exposes an area of the first electrode 231and defines a pixel region of the organic light-emitting device 230. Alight blocking layer BL may be disposed on a remaining region except forthe pixel region defined by the pixel defining layer 219.

For example, when the display unit 200 is of a top-emission type, thelight blocking layer BL may be formed on an upper surface of the pixeldefining layer 219. However, embodiments are not limited thereto, andthe pixel defining layer 219 or the passivation layer 209 may include amaterial that is capable of blocking light. On the other hand, when thedisplay unit 200 is of a bottom-emission type, the light blocking layerBL may be disposed between the island 101 and the thin film transistorTFT.

FIG. 15 is a magnified plan view of a portion A of FIG. 1 . FIG. 16 is across-sectional view taken along line VI-VI′ of FIG. 15 , and FIG. 17 isa cross-sectional view taken along line VII-VII′ of FIG. 15 , accordingto an embodiment.

Referring to FIGS. 15-17 , the display apparatus 10 may include aplurality of islands 101, a plurality of connection units 102 that areconnecting the plurality of islands 101 to one another, and a pluralityof display units 200 respectively disposed on the plurality of islands101. Inorganic layers and a passivation layer 209 of the display units200 may be consecutively formed on the islands 101 and the connectionunits 102. The inorganic layers may be the buffer layer 202, the firstinsulating layer 204, and the second insulating layer 206 included inthe thin film transistor TFT of FIG. 4 , respectively.

Each of the plurality of display units 200 may be encapsulated by theencapsulation layer 300 of FIG. 4 . The encapsulation layer 300 maycontact an exposed portion of the first insulating layer 204 or thesecond insulating layer 206 via the trench T.

Four connection units 102 are connected to one island 101. In detail, apair of first connection units 102 a positioned on opposite sides of oneisland 101 and each extending in the first direction X, and a pair ofsecond connection units 102 b positioned on opposite sides of the island101 and each extending in the second direction Y may be connected to theisland 101.

A first wiring unit may be positioned on the two first connection units102 a, and a second wiring unit may be positioned on the two secondconnection units 102 b. For example, the first wiring unit may include afirst voltage line V1, a second voltage line V2, and at least one dataline DL, and the second wiring unit may include at least one scan lineSL.

The first wiring unit and the second wiring unit may cross each other onthe island 101.

The first wiring unit may extend in the first direction X and mayinclude a region curved along a through hole V in the second directionY. Since the first wiring unit may extend in the first direction X andmay repeat a curved shape at regular intervals, non-uniformity ofbrightness or the like between the display units 200 due to the firstwiring unit may be reduced or prevented. A plurality of first wiringunits extending in the same direction may be formed not to overlap eachother to thereby minimizing interferences therebetween.

Similarly, since the second wiring unit may extend in the seconddirection Y, and a curved shaped in the first direction X may berepeated at regular intervals, non-uniformity of brightness or the likebetween the display units 200 due to the second wiring unit may bereduced or prevented. A plurality of second wiring units extending inthe same direction may be formed not to overlap each other to therebyminimizing interferences therebetween.

The first wiring unit and the second wiring unit may include the samematerial. For example, the first wiring unit and the second wiring unitmay have a stacked structure of Ti/Al/Ti and may include the samematerial used to form the source electrode 207 and the drain electrode208, which are highly flexible.

FIG. 16 illustrates an example in which a scan line SL is formed on asecond connection unit 102 b. The buffer layer 202, the first insulatinglayer 204, the second insulating layer 206, and the passivation layer209 may be sequentially stacked on the second connection unit 102 b inthe stated order, and the scan line SL may be formed on the passivationlayer 209. Since the scan line SL is connected to the gate electrode 205of the thin film transistor to apply a scan signal to the thin filmtransistor, the scan line SL and the gate electrode 205 of the thin filmtransistor may be electrically connected to each other via a contacthole.

FIG. 17 illustrates an example in which the first voltage line V1, thedata line DL, and the second voltage line V2 are formed on a firstconnection unit 102 a. The buffer layer 202, the first insulating layer204, the second insulating layer 206, and the passivation layer 209 maybe sequentially stacked on the first connection unit 102 a in the statedorder, and the first voltage line V1, the data line DL, and the secondvoltage line V2 may be formed on the passivation layer 209.

The data line DL may be connected to the drain electrode 208 of the thinfilm transistor to apply a data signal to the thin film transistor. Thefirst voltage line V1 may electrically connect first electrodes 231 ofFIG. 4 respectively included in a plurality of display units 200 andseparated from one another to one another.

According to embodiments of the present disclosure, since the pluralityof display units 200 respectively include separated second electrodes232 of FIG. 4 , to electrically connect the separated second electrodes232 to one another, the second voltage line V2 may have the same patternas or a similar pattern to the first voltage line V1, and the secondvoltage line V2 may be electrically connected to the second electrode232 via a contact hole.

FIG. 18 is a schematic cross-sectional view of a display apparatus 20,which is a modification of the display apparatus 10 of FIG. 1 .

Referring to FIG. 18 , the display apparatus 20 may include a substrate100 including a plurality of islands 101 and a plurality of connectionunits 102 that are connecting the plurality of islands 101 to oneanother, a plurality of display units 200 respectively disposed on theplurality of islands 101, a plurality of encapsulation layers 300respectively encapsulating the plurality of display units 200, and afirst protection film 410 and a second protection film 420 respectivelydisposed on an upper surface and a lower surface of the substrate 100.The substrate 100 may include a plurality of through holes V of FIG. 1that penetrate through the substrate 100 between the connection units102.

Since the substrate 100, the display unit 200, and the encapsulationlayer 300 are the same as those described above in the previousembodiments, repeated descriptions thereof may be omitted herein.

The first protection film 410 and the second protection film 420 mayprevent external foreign materials or the like from permeating thedisplay apparatus 20. The first protection film 410 and the secondprotection film 420 are formed of elongation sheets, and thus may beelongated or changed in shape when the display apparatus 20 is elongatedor changed in shape. For example, the first protection film 410 and thesecond protection film 420 may be biaxially oriented polypropylenefilms, biaxially oriented polyethylene terephthalate films, or the like.According to another embodiment, the first protection film 410 and thesecond protection film 420 may include, but is not limited to,polydimethylsiloxane (PDMS).

FIG. 19 is a schematic cross-sectional view of a display apparatus 30,which is another modification of the display apparatus 10 of FIG. 1 .

Referring to FIG. 19 , the display apparatus 30 may include a substrate100, a plurality of display units 200 disposed on the substrate 100, aplurality of encapsulation layers 300 respectively encapsulating theplurality of display units 200, a first protection film 410 and a secondprotection film 420 respectively disposed on an upper surface and alower surface of the substrate 100, and a functional layer 500 on thesecond protection film 420.

The substrate 100 may include a plurality of islands 101, a plurality ofconnection units 102 that are connecting the plurality of islands 101 toone another, and a plurality of through holes V penetrating through thesubstrate 100 between the plurality of connection units 102.

The plurality of display units 200 may be respectively disposed on theplurality of islands 101. The encapsulation layers 300, respectivelyencapsulating the plurality of display units 200, may also be disposedon the plurality of islands 101.

As described above with reference to FIG. 18 , the first protection film410 and the second protection film 420 may prevent external foreignmaterials or the like from permeating the display apparatus 30.

The functional layer 500 may include at least one of a polarizationlayer and a touch screen layer. The functional layer 500 may furtherinclude an optic film for external light reflection and a protectionlayer. The functional layer 500 is elongatable, and may be elongatedwhen the display apparatus 30 is elongated.

FIG. 20 is a magnified plan view of a portion A of FIG. 1 , according toanother embodiment.

Referring to FIG. 20 , the substrate 100 may include a plurality ofislands 101 spaced apart from one another, a plurality of connectionunits 102 that are connecting the plurality of islands 101 to oneanother, and a plurality of through holes V penetrating through thesubstrate 100 between the plurality of connection units 102.

A plurality of display units 200 may be disposed on the plurality ofislands 101, respectively. Each display unit 200 may include at least adisplay device to realize visible light. The display device may be anorganic light-emitting device. The plurality of display units 200 may beindependently encapsulated by a plurality of encapsulation layers 300.

The plurality of connection units 102 may connect the plurality ofislands 101 to one another. For example, four connection units 102 areconnected to each of the plurality of islands 101 and extend adjacent tothe island 101 in different directions, and thus the four connectionunits 102 may be respectively connected to other four adjacent islands101 surrounding the island 101.

The plurality of islands 101 and the plurality of connection units 102may be formed of the same material and may be connected to each other.In other words, the plurality of islands 101 and the plurality ofconnection units 102 may be integrally formed to have one body.

The inorganic layers and the passivation layer 209 of FIG. 4 of thedisplay units 200 may be consecutively formed on the islands 101 and theconnection units 102. The inorganic layers may include the buffer layer202 and the first insulating layer 204 and the second insulating layer206 included in the thin film transistor TFT of FIG. 4 , Theencapsulation layer 300 may contact an exposed portion of the firstinsulating layer 204 or the second insulating layer 206 via the trenchT. Accordingly, the encapsulation layer 300 may reduce or preventinfiltration of external moisture and oxygen into the display units 200via the passivation layer 209 that may be formed of an organic material.

Wiring units that are electrically connected to the display units 200may be disposed on the plurality of islands 101.

Referring to FIG. 20 , each connection unit 102 has at least one curvedportion. Accordingly, the shape of the at least one curved portionchanges when the substrate 100 is elongated, and intervals between theplurality of islands 101 may increase. Thus, the shape of the displayapparatus 10 of FIG. 1 may change two-dimensionally orthree-dimensionally.

The through holes V penetrate through the substrate 100. The throughholes V may provide separation areas between the plurality of islands101, reduce the weight of the substrate 100, and improve the flexibilityof the substrate 100. When the substrate 100 is bent, rolled, or thelike, the shapes of the through holes V change, and thus stressgenerated during deformation of the substrate 100 is effectivelyreduced. Thus, abnormal deformation of the substrate 100 may beprevented, and durability of the substrate 100 may improve. Accordingly,convenience and usability of the display apparatus 10 may improve, andthe display apparatus 10 may be suitably applied to bending displayapparatuses, flexible display apparatuses, or stretchable displayapparatuses.

According to embodiments of the present disclosure, even when the shapeof a display apparatus changes, an encapsulation layer may be preventedfrom being damaged, and infiltration of external moisture and oxygen maybe effectively prevented, thereby improving the reliability of thedisplay apparatus. It should be understood that the scope of the presentdisclosure is not restricted by this effect.

It should be understood that embodiments described herein should beconsidered in a descriptive sense and not for purposes of limitation.Descriptions of features or aspects within each embodiment shouldtypically be considered as available for other similar features oraspects in other embodiments.

While one or more embodiments have been described with reference to thefigures, it will be understood by those of ordinary skill in the artthat various changes in form and details may be made therein withoutdeparting from the spirit and scope of the present disclosure.

What is claimed is:
 1. A display apparatus comprising: a substratecomprising a plurality of first areas spaced apart from one another, aplurality of second areas connecting the plurality of first areas to oneanother, and a plurality of holes between the plurality of first andsecond areas; a display device emitting light and disposed on at leastone of the plurality of first areas, the display device comprising afirst electrode, an emission layer, and a second electrode; and at leastone inorganic layer and at least one organic layer disposed between thesubstrate and the display device, wherein the at least one organic layerextends over at least one of the plurality of second areas and comprisesat least one flexure having a step, and the flexure is disposed incorrespondence with the at least one second area.